Products

TSV Series

tsv-400

TSV-400

Desktop Dispensing System

Data Sheet

TSV Series desktop dispensing system is applicable for underll, LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, ngerprint identication module, etc. at SMT & PCB assembly, semiconductor package, electromechanical
assembly and at-panel-display assembly.


TSV-400 model is 400 x 400 mm on working platform.

 

 

Standard Features 

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certied

 

Optional Features 

Automatic constant temperature system to ensure the uidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation

 

System Specifcations

Dispensing Parameters
Standard Work Area

X 400 × Y 400 mm

(X 15.7“ × Y 15.7“ )

Maximum Components Height 95 mm (3.74”)
Operation Height Level 950 ± 20 mm (37.40" ± 0.79")
Number of Valve 1 set
Nozzle Cleaner Vacumm nozzle cleaning

 

 

Transmission System
Number of Axes X, Y, Z axis
Driver Servo motor
Maximum Moving Speed 1000 mm/s
Acceleration 0.8 g
Position Accuracy 

XY : ± 0.02 mm (±0.00078”)

Z : ±0.01 mm (±0.00039”)

Repeatable Accuracy

XY : < 0.015mm (< 0.00059”) 

Z : ± 0.005mm (±0.00019”) 

 

 

Vision System
Resolution 1296 x 966 px
Pixel Size

3.75 x 3.75 μm

Light Source Combination of ring light and co-axial light

 

 

Facility
Standard Footprint

L 910 x W 760 x H 760 mm

(L 35.82” x 29.92” x 29.92”)

Weight 90 kg (198 lb)
Ventilation 12m3/min
Air Requirement

95 psi (0.6MPa)

Input Power AC 220 V 50/60 Hz 10 A

 

 

Interface
Controller IPC and motion controal card 
Software Anda user interface with Windows OS
Programming  On-line vision programming
Communications Protocol SMEMA