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TSV Series desktop dispensing system is applicable for under ll, LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, ngerprint identi cation module, etc. at SMT & PCB assembly, semiconductor package, electromechanical
assembly and at-panel-display assembly.
TSV-300 model is 300 x 300 mm on working platform.
Standard Features
Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certi ed
Optional Features
Automatic constant temperature system to ensure the uidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation
System Specifcations
| Dispensing Parameters | |
| Standard Work Area |
X 300 × Y 300 mm (X 11.81“ × Y 11.81“) |
| Maximum Components Height | 95 mm (3.74”) |
| Operation Height Level | 950 ± 20 mm (37.40" ± 0.79") |
| Number of Valve | 1 set |
| Nozzle Cleaner | Vacumm nozzle cleaning |
| Transmission System | |
| Number of Axes | X, Y, Z axis |
| Driver | Servo motor |
| Maximum Moving Speed | 1000 mm/s |
| Acceleration | 0.8 g |
| Position Accuracy |
XY : ± 0.02 mm (±0.00078”) Z : ±0.01 mm (±0.00039”) |
| Repeatable Accuracy |
XY : < 0.015mm (< 0.00059”) Z : ± 0.005mm (±0.00019”) |
| Vision System | |
| Resolution | 1296 x 966 px |
| Pixel Size |
3.75 x 3.75 μm |
| Light Source | Combination of ring light and co-axial light |
| Facility | |
| Standard Footprint |
L 810 x W 660 x H 760 mm (L 31.88” x W 25.98” x H 29,92”) |
| Weight | 80 kg (176 lb) |
| Ventilation | 12m3/min |
| Air Requirement |
95 psi (0.6MPa) |
| Input Power | AC 220 V 50/60 Hz 10 A |
| Interface | |
| Controller | IPC and motion controal card |
| Software | Anda user interface with Windows OS |
| Programming | On-line vision programming |
| Communications Protocol | SMEMA |